Packaged semiconductor devices and methods of packaging semiconductor devices

ABSTRACT

Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and the molding compound. The molding compound is thicker than the integrated circuit die.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a continuation of U.S. patent application Ser. No.16/390,437, filed on Apr. 22, 2019, and entitled “Packaged SemiconductorDevices and Methods of Packaging Semiconductor Devices,” now U.S. Pat.No. 10,629,508, which is a continuation of U.S. patent application Ser.No. 15/906,399, filed on Feb. 27, 2018, and entitled “PackagedSemiconductor Devices and Methods of Packaging Semiconductor Devices,”now U.S. Pat. No. 10,269,673 issued on Apr. 23, 2019, which is acontinuation of U.S. patent application Ser. No. 14/995,865, filed onJan. 14, 2016, and entitled “Packaged Semiconductor Devices and Methodsof Packaging Semiconductor Devices,” now U.S. Pat. No. 9,911,675 issuedon Mar. 6, 2018, which is a division of U.S. patent application Ser. No.14/180,208, filed on Feb. 13, 2014, and entitled “Packaged SemiconductorDevices and Methods of Packaging Semiconductor Devices,” now U.S. Pat.No. 9,252,135 issued on Feb. 2, 2016, which applications areincorporated herein by reference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment, as examples. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductive layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

Dozens or hundreds of integrated circuits are typically manufactured ona single semiconductor wafer. The individual dies are singulated bysawing the integrated circuits along a scribe line. The individual diesare then packaged separately, in multi-chip modules, or in other typesof packaging, as examples.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. These smallerelectronic components also require smaller packages that utilize lessarea than packages of the past, in some applications.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 10 illustrate cross-sectional views of a method ofpackaging semiconductor devices at various stages in accordance withsome embodiments of the present disclosure.

FIGS. 11 and 12 illustrate cross-sectional views of a method ofpackaging semiconductor devices at various stages in accordance withsome embodiments.

FIG. 13 is a cross-sectional view illustrating a packaged semiconductordevice in accordance with some embodiments.

FIG. 14 is a cross-sectional view illustrating a packaged semiconductordevice in accordance with other embodiments.

FIG. 15 is a cross-sectional view illustrating a packaged semiconductordevice in accordance with some embodiments.

FIGS. 16 and 17 are more detailed views of portions of the packagedsemiconductor device shown in FIG. 15 in accordance with someembodiments.

FIG. 18 is a cross-sectional view illustrating a packaged semiconductordevice in accordance with some embodiments.

FIG. 19 is a flow chart of a method of packaging a semiconductor devicein accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Some embodiments of the present disclosure provide novel methods andstructures for packaging semiconductor devices. A sacrificial layer isformed over integrated circuit dies prior to forming a molding compoundaround the dies, and the sacrificial layer is later removed. Thesacrificial layer prevents molding compound residue from forming on theintegrated circuit dies, and the formation of recesses between theintegrated circuit dies and the molding compound is reduced orprevented.

FIGS. 1 through 10 illustrate cross-sectional views of a method ofpackaging semiconductor devices at various stages in accordance withsome embodiments. Referring first to FIG. 1, a workpiece 110 is providedthat includes a plurality of integrated circuit dies 106. The workpiece110 may include a semiconductor substrate comprising silicon or othersemiconductor materials and may be covered by an insulating layer, forexample. The workpiece 110 may also include other active components orcircuits, not shown. The workpiece 110 may comprise silicon oxide oversingle-crystal silicon, for example. The workpiece 110 may conductivelayers or semiconductor elements, e.g., transistors, diodes, etc.Compound semiconductors, GaAs, InP, Si/Ge, or SiC, as examples, may beused in place of silicon. The workpiece 110 may comprise asilicon-on-insulator (SOI) or a germanium-on-insulator (GOI) substrate,as examples. The workpiece 110 may comprise a wafer or strip comprisingthe plurality of integrated circuit dies 106, for example.Alternatively, the workpiece 110 may comprise other types of materials,material layers, and components formed thereon.

The integrated circuit dies 106 are formed within and/or over theworkpiece 110 may include a plurality of connectors such as contact pads114 disposed on a surface thereof. The contact pads 114 may comprise Cu,Al, other metals, or alloys, combinations, or multiple layers thereof,for example. The contact pads 114 may be disposed within an insulatingmaterial (not shown) which may comprise silicon nitride, silicondioxide, other insulators or polymers, or combinations or multiplelayers thereof, for example. The contact pads 114 may be coupled tointernal wiring of the integrated circuit dies 106, such as to viasand/or conductive lines in metallization layers or polysilicon layers ofthe integrated circuit dies 106, as examples, not shown.

Referring next to FIG. 2, a sacrificial layer 108 is formed over theworkpiece 110, e.g., over the integrated circuit dies 106. Thesacrificial layer 108 comprises a photoresist material, an organicmaterial, a polymer material, other materials that solidify aftercuring, and/or combinations of multiple layers thereof, in someembodiments, for example. In some embodiments, the sacrificial layer 108comprises polybenzoxazole (PBO), as an example. The sacrificial layer108 is formed in some embodiments using a spin-on method, chemical vapordeposition (CVD), a spin coating process, a printing process, or othercoating methods, as examples. The sacrificial layer 108 comprises amaterial layer having a thickness comprising dimension d₁, whereindimension d₁ comprises about 2 μm to about 5 μm in some embodiments. Insome embodiments, dimension d₁ comprises about 1 μm to about 10 μm, asanother example. Alternatively, the sacrificial layer 108 may compriseother materials, dimensions, and formation methods.

The integrated circuit dies 106 are singulated along scribe lines (notshown) using a die saw, laser, or other device, to form a plurality ofseparated integrated circuit dies 106, as shown in FIG. 3, which shows asingle integrated circuit die 106. In some embodiments, a backside ofthe workpiece 110 may be thinned using a grinding process prior to thesingulation process, for example. In other embodiments, the backside ofthe workpiece 110 is not thinned.

Next, a carrier 100 is provided, as shown in FIG. 4. The carrier 100 maycomprise a wafer such as a semiconductor wafer, or the carrier 100 maycomprise an organic substrate or other types of substrates. The carrier100 comprises a sacrificial component that will be removed after one ormore integrated circuit dies 106 are packaged, such as integratedcircuit dies 106 shown in FIG. 3. The carrier 100 may later be cleanedand used to package other semiconductor devices, for example.Alternatively, the carrier 100 may be discarded after the packagingprocess.

The carrier 100 includes a foil and die bond material 102 formedthereon. The foil facilitates in the later removal of the carrier 100from integrated circuit dies 106, for example. The die bond materialassists in adhering the integrated circuit dies 106 to the carrier 100,for example. In some embodiments, the die bond material of the foil anddie bond material 102 also includes a temperate bond layer that iscoated on the top surface of the carrier 100. The temperate bond layermay comprise about 1 μm to about 10 μm of a light to heat conversion(LTHC) material supplied by 3M, for example. The temperate bond layermay be formed using a deposition process or a spin coating process, asexamples. Alternatively, the foil and die bond material 102 may compriseother materials, dimensions, and formation methods. In some embodiments,the foil and die bond material 102 is not included.

A plurality of the integrated circuit dies 106 shown in FIG. 3 areinverted and are attached to the carrier 100, as shown in FIG. 4. Thesacrificial layer 108 disposed over the integrated circuit dies 106 iscoupled to the top surface of the carrier 100, for example. In someembodiments, a die attach film (DAF) (not shown) may be formed over thesacrificial layer 108 before or after the singulation process for theintegrated circuit dies 106, for example. The DAF may comprise a glue,an adhesive, or an adhesive film that is adapted to adhere theintegrated circuit dies 106 to the foil and die bond material 102disposed over the carrier 100 in some embodiments, for example. In someembodiments, a DAF is not included. The integrated circuit dies 106 maybe attached over the carrier 100 (e.g., over the foil and die bondmaterial 102 disposed over the carrier 100) using a pick-and-placemachine, other mechanism, or manually, for example.

In some embodiments, a single integrated circuit die 106 is coupled overthe carrier 100 (not shown). In other embodiments, a plurality ofintegrated circuit dies 106 are coupled over the carrier 100. In someembodiments, the integrated circuit dies 106 are packaged individuallyin separate packages. In other embodiments, a plurality of theintegrated circuit dies 106 are packaged together side-by-side in asingle package, e.g., in a two-dimensional (2D) packaging scheme. Two ormore of the integrated circuit dies 106 may be packaged together inaccordance with some embodiments, for example.

After the integrated circuit dies 106 are coupled to the carrier 100, amolding compound 120 is disposed around the integrated circuit dies 106over the carrier 100, as shown in FIG. 5. The molding compound 120 isformed using a laminating process or other process, in some embodiments.The molding compound 120 fills spaces between the dies 106 andencapsulates the dies 106, for example. The molding compound 120comprises a molding material and may comprise epoxy, an organic polymer,or a polymer with a silica-based or glass filler added, as examples. Insome embodiments, the molding compound 120 comprises a liquid moldingcompound (LMC) that is a gel type liquid when applied. Alternatively,the molding compound 120 may comprise other insulating materials and maybe applied using other methods. The molding compound 120 is then curedusing a heating process, infrared (IR) energy exposure process, anultraviolet (UV) light exposure process, or other methods, as examples.

If the molding compound 120 extends over a top surface of the integratedcircuit dies 106 after the curing process, the molding compound 120 isremoved from over the integrated circuit dies 106 using achemical-mechanical polish (CMP), grinding process, etch process, and/orother methods in some embodiments, for example. Because the sacrificiallayer 108 is disposed over the integrated circuit dies 106 during themolding compound 120 application and curing process, the moldingcompound 120 does not reside over the integrated circuit dies 106 afterthe application and curing process for the molding compound 120 in someembodiments, for example. The molding compound 120 is formed around theintegrated circuit dies 106 in some embodiments.

The carrier 100 and foil and die bond material 102 are removed, as shownin FIG. 6. The carrier 100 may be removed using a de-bonding process,and the foil and die bond material 102 are removed by peeling the foiland using a cleaning process to remove the die bond material, forexample.

The sacrificial layer 108 is removed, as shown in FIG. 7. Thesacrificial layer 108 is removed in some embodiments using an organicsolvent, an organic acid, or other materials. The sacrificial layer 108may be removed using as isopropyl alcohol (IPA), acetone, or ethanol insome embodiments, as examples. A surface of the integrated circuit dies106 and the contact pads 114 is left exposed after the removal of thesacrificial layer 108. In some embodiments, a top portion of the moldingcompound 120 in the view shown in FIG. 7 may be removed in the removalprocess for the sacrificial layer 108. In other embodiments, a topportion of the molding compound 120 is not removed.

Because the sacrificial layer 108 was disposed over the integratedcircuit dies 106 during the molding compound 120 application and curingprocess, the molding compound 120 does not reside over the integratedcircuit dies 106 in some embodiments, for example. In other embodiments,a portion of the molding compound 120 may form over the sacrificiallayer 108, and the portion of the molding compound 120 disposed over thesacrificial layer 108 is advantageously removed during the removal ofthe sacrificial layer 108.

The molding compound 120 has a first thickness comprising dimension d₂in some embodiments, and the integrated circuit dies 106 have a secondthickness comprising dimension d₃ in some embodiments. Dimensions d₂ andd₃ may comprise about 100 μm to about 500 μm, as examples. Dimension d₂is greater than dimension d₃ in some embodiments. Dimension d₂ isgreater than dimension d₃ by about dimension d₁ in some embodiments, forexample. Dimension d₁ comprises a thickness of the sacrificial layer108, and dimension d₁ also comprises a difference in the thicknesses ofthe molding compound 120 and the integrated circuit dies 106, forexample.

Dimension d₁ also comprises an amount of a step height between theintegrated circuit dies 106 and the molding compound 120, as anotherexample. In other words, dimension d₁ comprises a distance between a topsurface of the molding compound 120 and a top surface of the integratedcircuit dies 106 in the view shown in FIG. 7.

The novel structure of the packaging device at the packaging step shownin FIG. 7 comprises integrated circuit dies 106 encapsulated by moldingcompound 120, yet the molding compound 120 is not disposed over the topsurfaces of the integrated circuit dies 106 in the view shown in FIG. 7.The molding compound 120 top surface is higher than the integratedcircuit die 106 top surface in the view shown in FIG. 7, for example.

An interconnect structure 122 is formed over the integrated circuit dies106 and the molding compound 120, as shown in FIG. 8. The interconnectstructure 122 includes a plurality of insulating material layers 124 anda plurality of conductive lines 126 and a plurality of conductive vias128 formed within the insulating material layers 124. The interconnectstructure 122 may include a plurality of contact pads 130 formedproximate a surface thereof. The contact pads 130 may comprise ball gridarray (BGA) ball mounts in some embodiments, for example. In someembodiments, portions of the interconnect structure 122 comprise anunder-ball metallization (UBM) structure, as another example. Theinsulating material layers 124 may comprise polybenzoxazole (PBO) orother insulators, and the conductive lines 126, conductive vias 128, andcontact pads 130 may comprise Cu, Al, other metals, or alloys ormultiple layers thereof, in some embodiments, as examples. The pluralityof insulating material layers 124, plurality of conductive lines 126,plurality of conductive vias 128, and contact pads 130 of theinterconnect structure 122 may be formed using subtractive etchtechniques, by damascene techniques, other methods, or combinationsthereof, for example. The interconnect structure 122 is disposed overthe integrated circuit dies 106 and the molding compound 120, forexample.

In some embodiments, the interconnect structure 122 may comprise aredistribution layer (RDL) or a post-passivation interconnect (PPI)structure, for example. In some embodiments, the interconnect structure122 comprises horizontal electrical connections for the packagedsemiconductor devices (see packaged semiconductor devices 140 shown inFIG. 9), for example. The interconnect structure 122 may comprisefan-out electrical connections in some embodiments. In embodimentswherein two or more of the integrated circuit dies 106 are packagedtogether, the interconnect structure 122 may comprise horizontalelectrical connections between the integrated circuit dies 106, forexample. Alternatively, the interconnect structure 122 may compriseother types of electrical connection structures.

Because of the step height comprising dimension d₁ between theintegrated circuit dies 106 and the molding compound 120, a portion ofthe interconnect structure 122 extends downwardly below a top surface ofthe molding compound 120 in the view shown in FIG. 8. For example, aportion of a lower level insulating material 124 layer and a lowerportion of conductive vias 128 coupled to the contact pads 114 of theintegrated circuit dies 106 extend below a top surface of the moldingcompound 120 to make electrical contact to the integrated circuit dies106.

In some embodiments, a plurality of conductors 132 are coupled to theinterconnect structure 122, as shown in FIG. 9. The plurality ofconductors 132 are coupled to portions of the interconnect structure 122in some embodiments, for example. The plurality of conductors 132 may becoupled to the contact pads 130 of the interconnect structure 122 insome embodiments, as shown in FIG. 9. The conductors 132 are formed overand are coupled to portions of the horizontal electrical connections ofthe interconnect structure 122 in some embodiments, for example.

The conductors 132 may comprise a eutectic material such as solder thatis coupled to contact pads 130 or bond pads of the interconnectstructure 122, for example. The conductors 132 may each comprise asolder bump or a solder ball, as examples. The conductors 132 mayfunction as electrical connectors for the packaged semiconductor device.The eutectic material of the conductors 132 may be re-flowed toelectrically and mechanically connect the packaged semiconductor deviceto another device or object, for example.

The use of the word “solder” herein includes both lead-based andlead-free solders, such as Pb—Sn compositions for lead-based solder;lead-free solders including InSb; tin, silver, and copper (“SAC”)compositions; and other eutectic materials that have a common meltingpoint and form conductive solder connections in electrical applications.For lead-free solder, SAC solders of varying compositions may be used,such as SAC 105 (Sn 98.5%, Ag 1.0%, Cu 0.5%), SAC 305, and SAC 405, asexamples. Lead-free conductors 132 such as solder balls may be formedfrom SnCu compounds as well, without the use of silver (Ag).Alternatively, lead-free solder connectors may include tin and silver,Sn—Ag, without the use of copper. The conductors 132 may be one among anarray of the conductors 132 formed as a grid, referred to as a “ballgrid array” or “BGA”. The conductors 132 may alternatively be arrangedin other shapes. The conductors 132 may also comprise non-sphericalconductive connectors, for example. In some embodiments, the conductors132 are not included.

In some embodiments, the interconnect structure 122 and the moldingcompound 120 are singulated using a die saw, laser, or other device toform a plurality of packaged semiconductor devices 140, as shown in FIG.10, with each of the plurality of packaged semiconductor devices 140including one of the plurality of integrated circuit dies 106. Theinterconnect structure 122 and the molding compound 120 may besingulated on scribe lines 133 between adjacent integrated circuit dies106, as shown in FIG. 9, for example. In some embodiments, the packagedsemiconductor devices 140 may be attached to a dicing tape (not shown)before the singulation process, and the dicing tape is removed after thesingulation process.

In other embodiments, the interconnect structure 122 and the moldingcompound 120 are singulated to form a plurality of packagedsemiconductor devices 140 (see FIGS. 13, 14 and 15), each of theplurality of packaged semiconductor devices 140 including two or more ofthe plurality of integrated circuit dies 106. The integrated circuitdies 106 packaged together in the packaged semiconductor device 140 maycomprise similar, the same, or different functions, for example. Themolding compound 120 is disposed around the integrated circuit dies 106and between adjacent integrated circuit dies 106.

FIGS. 11 and 12 illustrate cross-sectional views of a method ofpackaging semiconductor devices at various stages in accordance withsome embodiments. After the packaging process steps shown in FIGS. 1through 7, a plurality of through-vias 138 are formed within the moldingcompound 120. The through-vias 138 may be formed using an etch processor laser drilling process after the molding compound 120 is applied toform apertures in the molding compound 120, and a conductive materialmay be filled into the apertures using a deposition or plating processto form the through-vias 138, for example. In other embodiments, beforethe integrated circuits dies 106 are attached to the carrier 100, thethrough-vias 138 may be plated onto the carrier 100 by forming a seedlayer over the carrier 100, forming a photoresist over the seed layer,patterning the photoresist using a lithography process, and plating aconductive material such as Cu, a Cu alloy, or other metals over theseed layer through the patterned photoresist to form the through-vias138. The photoresist is then removed. The packaging process steps shownin FIGS. 4 through 7 are then performed. Alternatively, the through-vias138 may be formed using other methods. The packaging process steps shownin FIGS. 8 and 9 are then performed, to form the interconnect structure122 and conductors 132, as shown in FIG. 12, and the packagedsemiconductor devices 140′ are singulated along scribe lines 133.

In some embodiments, the plurality of conductors 132 of the packagedsemiconductor devices 140 (and also packaged semiconductor devices 140′,not shown) are coupled to a substrate 144, as shown in FIG. 13 in across-sectional view. The substrate 144 may comprise a printed circuitboard (PCB) in some embodiments. Alternatively, the substrate 144 maycomprise other materials, such as an interposer, another integratedcircuit die, or other objects, as example. The packaged semiconductordevice 150 includes the packaged semiconductor device 140 that iscoupled to the substrate 144.

In some embodiments, an underfill material 146 may be disposed betweenthe plurality of conductors 132 and between the substrate 144 and theinterconnect structure 122, also illustrated in FIG. 13. The underfillmaterial 146 may comprise an epoxy material, a SiO₂ filler or otherfillers, or other materials, as example. The underfill material 146 maybe applied using a needle along one or more sides of the packagedsemiconductor device 150 or through an aperture formed within themolding compound 120 and interconnect structure 122, for example, notshown.

The molding compound 120 is also referred to herein as a first moldingcompound 120. In some embodiments, a second molding compound 134 isdisposed around the plurality of conductors 132, as shown in FIG. 14.The second molding compound 134 may comprise similar materials describedfor the first molding compound 120, for example. In some embodiments,the second molding compound 134 comprises an LMC. In some embodiments,the second molding compound 134 is not included. In other embodiments,the second molding compound 134 is included, and an underfill material146 is not included, not shown.

In some embodiments, the second molding compound 134 is included, and anunderfill material 146 is also included in the packaged semiconductordevice 150, also shown in FIG. 14. The second molding compound 134 maybe disposed between the plurality of conductors 132 and between theunderfill material 146 and the interconnect structure 122, for example.

In some embodiments, a lid, a heat spreader, or a backside protectivefilm 142 is disposed over the molding compound 120 and the integratedcircuit die or dies 106, as shown in FIG. 15. The lid or heat spreader142 may comprise Al, Cu, alloys thereof, ceramic, or other materialscomprising a thickness of about 100 μm to about 1,000 μm, or otherdimensions, as examples. The protective film 142 may comprise about 10μm to about 100 μm of a polymer, an epoxy, or other materials, asexamples. The lid, heat spreader, or backside protective film 142 may beattached using an adhesive or formed using a deposition or coatingprocess, for example. Alternatively, a lid, heat spreader, or backsideprotective film 142 may not be included.

In some embodiments, the interconnect structure 122 is disposed over afirst side of the integrated circuit die or dies 106 and the moldingcompound 120 (e.g., the bottom side in the view shown in FIG. 15). Thelid, heat spreader, or backside protective film 142 is disposed over asecond side of the integrated circuit die or dies 106 and the moldingcompound 120 (e.g., the top side in the view shown in FIG. 15). Thesecond side is opposite the first side of the integrated circuit die ordies 106 and the molding compound 120.

FIGS. 16 and 17 are more detailed views of portions of the packagedsemiconductor device 150 shown in FIG. 15 in accordance with someembodiments. FIG. 16 shows a cross-sectional view of a lower corner ofan integrated circuit die 106 proximate the molding compound 120. Aportion of the interconnect structure 122 comprising dimension d₁ due tothe step height between the molding compound and the integrated circuitdie 106 is shown; e.g., after applying the molding compound 120, theintegrated circuit die 106 surface is different than the moldingcompound 120 surface. The step height comprising dimension d₁advantageously prevents or reduces a recess from forming between theintegrated circuit dies 106 proximate the interconnect structure 122and/or molding compound 120, e.g., which may form during a curingprocess for the molding compound 120 or from grinding processes used topackage the semiconductor devices.

In some embodiments, the molding compound 120 includes a filler thatcomprises glass spheres 152, as shown in FIG. 17 in a cross-sectionalview. Advantageously, grinding processes used in the packaging processesare prevented from deleteriously affecting the filler materials of themolding compound 120, because of the inclusion of the backsideprotective film 142 in some embodiments, for example.

FIG. 18 is a cross-sectional view illustrating a packaged semiconductordevice 160 in accordance with some embodiments. The packagedsemiconductor device 160 comprises a package-on-a package (PoP) devicein accordance with some embodiments. The PoP device 160 includes apackaged semiconductor device 150 described herein that is coupled to apackaged semiconductor device 170. The packaged semiconductor device 150comprises a first packaged semiconductor device, and the packagedsemiconductor device 170 comprises a second packaged semiconductordevice that is coupled to the packaged semiconductor device 150 inaccordance with some embodiments, for example.

The packaged semiconductor device 150 includes a plurality ofthrough-vias 138 formed within the molding compound 120. Thethrough-vias 138 provide vertical connections for the packagedsemiconductor devices 150 and 160. Contact pads 164 are coupled to thethrough-vias 138. The contact pads 164 may be formed over or within themolding compound 120, as illustrated in FIG. 18. The contact pads 164 ofthe packaged semiconductor device 150 are coupled to contact pads (notshown) of packaged semiconductor device 170 by conductors 178 which maycomprise solder balls or other materials. The conductors 178 maycomprise similar materials described for conductors 132, for example.

Packaged semiconductor device 170 includes one or more integratedcircuit dies 176 coupled to a substrate 174. Wire bonds 172 may becoupled to contact pads on a top surface of the integrated circuit dieor dies 176, which are coupled to bond pads (not shown) on the substrate174. A molding compound 168 may be disposed over the wire bonds 172,integrated circuit die or dies 176, and the substrate 174.

Alternatively, a PoP device 160 may include two packaged semiconductordevices 150 described herein that are coupled together in someembodiments, not shown in the drawings. In some embodiments, the PoPdevice 160 may comprise a system-on-a-chip (SOC) device, as anotherexample.

In FIGS. 13 through 15 and 18, the step height comprising dimension d₁is not shown; however, the packaged semiconductor devices 150 and 160shown in FIGS. 13 through 15 and 18 include the step height between themolding compound 120 and the integrated circuit dies 106 that is shownin FIGS. 7 through 12, in accordance with some embodiments of thepresent disclosure.

FIG. 19 is a flow chart 180 of a method of packaging semiconductordevices in accordance with some embodiments. In step 182, a sacrificiallayer 108 (see also FIG. 2) is disposed over an integrated circuit die106. In step 184, the integrated circuit die 106 is coupled to a carrier100 (FIG. 4). In step 186, a molding compound 120 is disposed around theintegrated circuit die 106 (FIG. 5). In step 188, the sacrificial layer108 is removed (FIG. 7). In step 190, an interconnect structure 122 isformed over the integrated circuit die 106 and the molding compound 120(FIG. 8).

Embodiments of the present disclosure include methods of packagingsemiconductor devices, and also include packaged semiconductor devicesthat have been packaged using the methods described herein. Someembodiments include PoP devices that include the packaged semiconductordevices described herein. Some embodiments are particularly beneficialwhen implemented in wafer level packaging (WLP) applications, fan-outWLP (FOWLP) applications, 2D packages, 3D packages, and other types ofpackaging, as examples.

Advantages of some embodiments of the present disclosure includeproviding a novel sacrificial layer 108 and packaging process thatresults in reduced recessing between a molding compound and integratedcircuit dies encapsulated by the molding compound. The sacrificial layer108 also prevents or reduces overflow of the molding compound over theintegrated circuit dies, preventing molding compound residue fromforming on the integrated circuit dies in some embodiments. Residualmolding compound that may form over the sacrificial layer 108 is removedwhen the sacrificial layer 108 is removed, thus avoiding a need for agrinding process to remove excess molding compound from over theintegrated circuit dies. The sacrificial layer 108 also prevents failureof the interconnect structures by preventing or reducing recessesbetween the molding compound and integrated circuit dies. Increasedpackaging yields are achievable by implementing embodiments of thepresent disclosure. Furthermore, the novel packaged semiconductordevices and methods are easily implementable into packaging processflows.

In an embodiment, a device includes: a first integrated circuit die; afirst molding compound at least laterally encapsulating the firstintegrated circuit die; a through via extending through the firstmolding compound; and a redistribution structure including: a dielectriclayer over the first molding compound, a first portion of the dielectriclayer being at least partially disposed beneath a topmost surface of thefirst molding compound, a second portion of the dielectric layer beingdisposed above the topmost surface of the first molding compound; and ametallization pattern having a conductive line extending along thedielectric layer, a first conductive via extending through the firstportion of the dielectric layer to physically and electrically couple tothe first integrated circuit die, and a second conductive via extendingthrough the second portion of the dielectric layer to physically andelectrically couple to the through via.

In some embodiments of the device, a first height of the firstconductive via is less than a second height of the second conductivevia. In some embodiments of the device, a difference between the firstheight and the second height is in a range of from 2 μm to 5 μm. In someembodiments of the device, the dielectric layer and the first integratedcircuit die both contact a first sidewall of the first molding compound.In some embodiments, the device further includes: a package substrate;conductive connectors electrically coupling the package substrate to themetallization pattern; and an underfill surrounding the conductiveconnectors. In some embodiments, the device further includes: a secondmolding compound disposed between the underfill and the redistributionstructure, the second molding compound surrounding at least a portion ofthe conductive connectors. In some embodiments, the device furtherincludes: a second integrated circuit die electrically coupled to thethrough via, the second integrated circuit die and the redistributionstructure being disposed at opposing sides of the first integratedcircuit die. In some embodiments, the device further includes: a heatspreader attached to the first integrated circuit die and the firstmolding compound, the first integrated circuit die being disposedbetween the heat spreader and the redistribution structure.

In an embodiment, a device includes: a first integrated circuit die; aredistribution structure over the first integrated circuit die, theredistribution structure physically and electrically coupled to thefirst integrated circuit die; a first molding compound at leastlaterally encapsulating the first integrated circuit die and a lowerportion of the redistribution structure, an upper portion of theredistribution structure being disposed over the first molding compound;and a through via extending through the first molding compound, thethrough via physically and electrically coupled to the redistributionstructure.

In some embodiments of the device, a first height of the firstintegrated circuit die is less than a second height of the through via.In some embodiments of the device, a difference between the first heightand the second height is in a range of from 2 μm to 5 μm. In someembodiments of the device, the redistribution structure includes:insulating material layers; conductive lines disposed within theinsulating material layers; and conductive vias disposed within andextending through the insulating material layers, where a firstconductive via of the conductive vias has a lower portion and an upperportion over the lower portion, the lower portion of the firstconductive via extending below a major surface of the first moldingcompound to physically and electrically couple to the first integratedcircuit die, the upper portion of the first conductive via extendingabove the major surface of the first molding compound to physically andelectrically couple to one of the conductive lines. In some embodiments,the device further includes: a package substrate; conductive connectorselectrically coupling the package substrate to the redistributionstructure; and an underfill surrounding the conductive connectors. Insome embodiments, the device further includes: a second molding compounddisposed between the underfill and the redistribution structure, thesecond molding compound surrounding at least a portion of the conductiveconnectors. In some embodiments, the device further includes: a secondintegrated circuit die electrically coupled to the through via, thesecond integrated circuit die and the redistribution structure beingdisposed at opposing sides of the first integrated circuit die. In someembodiments, the device further includes: a heat spreader attached tothe first integrated circuit die and the first molding compound, thefirst integrated circuit die being disposed between the heat spreaderand the redistribution structure.

In an embodiment, a device includes: a first integrated circuit diehaving a first height; a first molding compound at least laterallyencapsulating the first integrated circuit die, the first moldingcompound having a second height, the second height being greater thanthe first height; a redistribution structure adjacent the first moldingcompound and the first integrated circuit die; and a heat spreaderadjacent the first molding compound and the first integrated circuitdie, the first molding compound and the first integrated circuit diebeing disposed between the heat spreader and the redistributionstructure.

In some embodiments, the device further includes: a package substrate;conductive connectors electrically coupling the package substrate to theredistribution structure; and an underfill surrounding the conductiveconnectors. In some embodiments, the device further includes: a secondmolding compound disposed between the underfill and the redistributionstructure, the second molding compound surrounding at least a portion ofthe conductive connectors. In some embodiments of the device, adifference between the first height and the second height is in a rangeof from 2 μm to 5 μm.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A device comprising: an integrated circuit diehaving a first height; a molding compound laterally encapsulating theintegrated circuit die, the molding compound having a second height, thesecond height greater than the first height, the first height and thesecond height each measured with respect to a backside of the integratedcircuit die; a heat spreader disposed at a backside of the moldingcompound and the backside of the integrated circuit die; an interconnectstructure disposed at a front side of the molding compound and a frontside of the integrated circuit die; and a reflowable connectorelectrically connected to the interconnect structure.
 2. The device ofclaim 1, wherein the interconnect structure comprises: a firstconductive via electrically connecting the reflowable connector to theintegrated circuit die.
 3. The device of claim 2, wherein theinterconnect structure further comprises: insulating material layers;and a plurality of conductive vias disposed within the insulatingmaterial layers, the first conductive via being one of the plurality ofconductive vias.
 4. The device of claim 1, wherein the interconnectstructure comprises a contact pad, the device further comprising: apackage substrate, the reflowable connector electrically connecting thepackage substrate to the contact pad.
 5. The device of claim 4, whereinthe molding compound laterally encapsulates a first portion of theinterconnect structure, a second portion of the interconnect structuredisposed between the molding compound and the package substrate.
 6. Thedevice of claim 1, wherein the first height and the second height areeach in a range of 100 μm to 500 μm.
 7. The device of claim 1, whereinthe heat spreader is a copper lid, the copper lid attached to thebackside of the molding compound and the backside of the integratedcircuit die with an adhesive.
 8. A device comprising: a first integratedcircuit die having a first surface and a second surface opposite thefirst surface, the first integrated circuit die comprising a firstcontact pad at the first surface; a first molding compound disposedaround the first integrated circuit die, first molding compound having athird surface and a fourth surface opposite the third surface, the firstmolding compound being thicker than the first integrated circuit die ina first direction, the first direction extending between the thirdsurface and the fourth surface, the fourth surface being coplanar withthe second surface; an interconnect structure adjacent a major surfaceof the first molding compound and the first surface of the firstintegrated circuit die, the interconnect structure comprising a firstconductive via; and a reflowable connector electrically connected to thefirst contact pad by the first conductive via.
 9. The device of claim 8,wherein the interconnect structure further comprises: insulatingmaterial layers; and a plurality of conductive vias disposed within theinsulating material layers, the first conductive via being one of theplurality of conductive vias.
 10. The device of claim 8, wherein theinterconnect structure comprises a second contact pad, the devicefurther comprising: a package substrate, the reflowable connectorelectrically connecting the package substrate to the second contact pad;and an underfill surrounding the reflowable connector.
 11. The device ofclaim 8, wherein the first molding compound is from 2 μm to 5 μm thickerthan the first integrated circuit die.
 12. The device of claim 8 furthercomprising: a heat spreader adjacent the second surface of the firstintegrated circuit die and the fourth surface of the first moldingcompound.
 13. The device of claim 12, wherein the heat spreader is acopper lid, the copper lid attached to the second surface of the firstintegrated circuit die and the fourth surface of the first moldingcompound with an adhesive.
 14. The device of claim 8 further comprising:a second integrated circuit die adjacent the second surface of the firstintegrated circuit die and the fourth surface of the first moldingcompound; and a through-via extending through the first moldingcompound, the through-via electrically connecting the second integratedcircuit die to the first integrated circuit die.
 15. The device of claim14 further comprising: a second molding compound disposed around thesecond integrated circuit die.
 16. A device comprising: a heat spreader;an interconnect structure comprising a first conductive via; a moldingcompound between the interconnect structure and the heat spreader, themolding compound having a first thickness measured in a first direction,the first direction extending from the heat spreader to the interconnectstructure; an integrated circuit die in the molding compound, theintegrated circuit die having a second thickness measured in the firstdirection, the second thickness less than the first thickness; areflowable connector electrically connected to the integrated circuitdie by the first conductive via; a package substrate electricallyconnected to the reflowable connector; and an underfill surrounding thereflowable connector.
 17. The device of claim 16, wherein the heatspreader is a copper lid, the copper lid attached to the integratedcircuit die with an adhesive.
 18. The device of claim 16, wherein thefirst thickness and the second thickness are each in a range of 100 μmto 500 μm.
 19. The device of claim 16, wherein the molding compound isfrom 2 μm to 5 μm thicker than the integrated circuit die.
 20. Thedevice of claim 16, wherein the interconnect structure furthercomprises: insulating material layers; and a plurality of conductivevias disposed within the insulating material layers, the firstconductive via being one of the plurality of conductive vias.